Kio Xia recently announced the latest consumer eMMC 5.1 product, which integrates the updated version of BiCS FLASH from Armor ™  3D flash memory and controller reduce processor workload and improve usability. Available in 64GB and 128GB capacity options.

Compared to the previous generation, the new eMMC 5.1 product has improved sequential and random write performance by approximately 2.5 times, and random read performance by approximately 2.7 times. In addition, TBW has increased by approximately 3.3 times compared to the previous generation of devices.

At present, the new product is still in the sample stage and is expected to achieve mass production in the spring of 2024.